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10/29/2022 10:42:58 AM
Power semiconductor plays a great role in product energy saving. In the foreseeable future, whether it is hydropower, nuclear power, thermal power or wind power, or even chemical electric energy provided by various batteries, it will be the most important energy consumed by human beings. However, more than 75% of electric energy applications need to be converted by power semiconductors before they can be used by electronic equipment. Moreover, power semiconductors can make the use of electric energy more efficient, more energy-saving, more environmentally friendly, and provide users with more convenience. Therefore, the development and application prospects of power semiconductors will be very broad. The application scope is expanding from the traditional industrial control field-4C field (computer, communication, consumer electronics and automobile electronics) to all aspects of national economy and national defense construction.
Although China has the largest power semiconductor market in the world, there is still a big gap between the research and development of domestic power semiconductor products and international companies, especially the gap of high-end devices is more obvious. Taking IGBT as an example, the core technologies are in the hands of enterprises in developed countries, and the high integration of IGBT technology leads to a high market concentration. Compared with domestic manufacturers, Infineon, mitsubishi electric, Fuji Electric and Hitachi have absolute market advantages. One of the reasons for this situation is that international manufacturers started early and invested heavily in research and development, especially in the traditional silicon-based semiconductor field, which formed patent barriers. Second, the level of high-end manufacturing in foreign countries is much higher than that in China, which supports the technological advantages of international manufacturers to some extent. The development of power semiconductor industry in China must change the current situation that technology is at a disadvantage, especially to make a breakthrough in the upstream level of the industrial chain, and change the current situation that packaging is stronger than chips in the field of power devices.
Generally speaking, the current technical development direction of power semiconductors is: first, the adoption of silicon carbide chips; Second, the various functions carried in the power semiconductor; Thirdly, in packaging technology, by abandoning the binding wire, the power semiconductor has a longer life, better stability and higher power density. Therefore, China's power semiconductor enterprises need to recognize the development trend of technology, strengthen the introduction and absorption of technical force, drive design by the market, promote chips by design, expand the industry by chips, increase the innovation of domestic power semiconductor technology and improve product performance, so as to meet the market demand, promote the healthy development of power semiconductor market and promote the technological progress and industrial upgrading of domestic electronic information industry.
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