Manufacturer Packaging Series ProductStatus ConvertFrom(AdapterEnd) ConvertTo(AdapterEnd) NumberofPins Pitch-Mating ContactFinish-Mating MountingType Termination Pitch-Post ContactFinish-Post HousingMaterial












































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus ConvertFrom(AdapterEnd) ConvertTo(AdapterEnd) NumberofPins Pitch-Mating ContactFinish-Mating MountingType Termination Pitch-Post ContactFinish-Post HousingMaterial
20-350000-10-HT

20-350000-10-HT

SOCKET ADAPTER SOIC TO 20DIP 0.3

Aries Electronics

1,375 18.20

RFQ

20-350000-10-HT

Datasheet

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 20 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
16-350000-10-HT

16-350000-10-HT

SOCKET ADAPTER SOIC TO 16DIP 0.3

Aries Electronics

2,870 18.20

RFQ

16-350000-10-HT

Datasheet

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 16 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
16-354000-11-RC

16-354000-11-RC

SOCKET ADAPTER DIP TO 16SOIC

Aries Electronics

1,225 18.20

RFQ

16-354000-11-RC

Datasheet

Bulk Correct-A-Chip® 354000 Active DIP, 0.3 (7.62mm) Row Spacing SOIC 16 0.100 (2.54mm) Gold Surface Mount Solder 0.050 (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled
24-35W000-10

24-35W000-10

SOCKET ADAPT SOIC-W TO 24DIP 0.3

Aries Electronics

4,517 18.30

RFQ

24-35W000-10

Datasheet

Bulk Correct-A-Chip® 35W000 Active SOIC-W DIP, 0.3 (7.62mm) Row Spacing 24 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
800-27-6-1

800-27-6-1

ADAPTER

TE Connectivity Deutsch Connectors

1,909 18.41

RFQ

Bag * Active - - - - - - - - - -
18-665000-00

18-665000-00

SCK ADAPT 18P SOIC-W TO SOIC 0.6

Aries Electronics

2,996 18.87

RFQ

18-665000-00

Datasheet

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 18 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
20-665000-00

20-665000-00

SCK ADAPT 20P SOIC-W TO SOIC 0.6

Aries Electronics

4,253 19.02

RFQ

20-665000-00

Datasheet

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 20 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
16-35W000-10

16-35W000-10

SOCKET ADAPT SOIC-W TO 16DIP 0.3

Aries Electronics

3,276 19.13

RFQ

16-35W000-10

Datasheet

Bulk Correct-A-Chip® 35W000 Active SOIC-W DIP, 0.3 (7.62mm) Row Spacing 16 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
22-665000-00

22-665000-00

SCK ADAPT 22P SOIC-W TO SOIC 0.6

Aries Electronics

2,621 19.19

RFQ

22-665000-00

Datasheet

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 22 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
1106396-40

1106396-40

SOCKET ADAPTER DIP TO 40DIP 0.6

Aries Electronics

2,278 19.26

RFQ

1106396-40

Datasheet

Bulk Correct-A-Chip® 1106396 Active DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing 40 0.100 (2.54mm) Gold Through Hole Solder 0.100 (2.54mm) Tin Polyamide (PA46), Nylon 4/6, Glass Filled
1107254-40

1107254-40

SOCKET ADAPTER DIP TO 40DIP 0.3

Aries Electronics

2,527 19.26

RFQ

1107254-40

Datasheet

Bulk Correct-A-Chip® 1107254 Active DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing 40 0.100 (2.54mm) Gold Through Hole Solder 0.100 (2.54mm) Tin Polyamide (PA46), Nylon 4/6, Glass Filled
28-665000-00

28-665000-00

SCK ADAPT 28P SOIC-W TO SOIC 0.6

Aries Electronics

4,801 19.68

RFQ

28-665000-00

Datasheet

Bulk Correct-A-Chip® 665000 Active SOIC-W SOIC 28 0.050 (1.27mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
20-350001-11-RC

20-350001-11-RC

SOCKET ADAPTER SOJ TO 20DIP 0.3

Aries Electronics

3,424 19.81

RFQ

20-350001-11-RC

Datasheet

Tube Correct-A-Chip® 350000 Active SOJ DIP, 0.3 (7.62mm) Row Spacing 20 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin -
PA-SOD6SM18-40

PA-SOD6SM18-40

ADAPTER 40SOIC TO 40DIP

Logical Systems Inc.

1,717 20.00

RFQ

PA-SOD6SM18-40

Datasheet

Bulk - Active SOIC DIP, 0.6 (15.24mm) Row Spacing 40 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) - -
PA-TS1D6SM18-40

PA-TS1D6SM18-40

ADAPTER 40TSOP TO 40DIP

Logical Systems Inc.

1,314 20.00

RFQ

PA-TS1D6SM18-40

Datasheet

Bulk - Active TSOP DIP 40 0.020 (0.50mm) - Through Hole Solder 0.100 (2.54mm) - -
20-555000-00

20-555000-00

SOCKET ADAPTER SSOP/SOWIC 20POS

Aries Electronics

4,419 20.03

RFQ

Bulk Correct-A-Chip® 555000 Active SSOP SOWIC 20 0.026 (0.65mm) - Surface Mount Solder 0.050 (1.27mm) Tin-Lead -
10-350000-10-HT

10-350000-10-HT

SOCKET ADAPTER SOIC TO 10DIP 0.3

Aries Electronics

1,156 20.16

RFQ

10-350000-10-HT

Datasheet

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 10 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
12-350000-10-HT

12-350000-10-HT

SOCKET ADAPTER SOIC TO 12DIP 0.3

Aries Electronics

3,522 20.16

RFQ

12-350000-10-HT

Datasheet

Bulk Correct-A-Chip® 350000 Active SOIC DIP, 0.3 (7.62mm) Row Spacing 12 0.050 (1.27mm) Tin Through Hole Solder 0.100 (2.54mm) Tin-Lead -
20-301550-10

20-301550-10

SOCKET ADAPTER SOIC TO 20PLCC

Aries Electronics

1,143 20.28

RFQ

20-301550-10

Datasheet

Bulk Correct-A-Chip® 301550 Active SOIC PLCC 20 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
20-301550-20

20-301550-20

SOCKET ADAPTER SOIC TO 20PLCC

Aries Electronics

2,151 20.28

RFQ

20-301550-20

Datasheet

Bulk Correct-A-Chip® 301550 Active SOIC PLCC 20 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) Tin-Lead -
Total 274 Records«Prev12345678...14Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • Quality assurance, Original authentic

    Quality assurance, Original authentic

    All Anmsi components are from the original factory or agent Regular channel procurement

    Global Supply Chain

    Global Supply Chain

    Enables us to resolve all shortages of customers.efficient BOM materials offer and professional technical support.

    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER