Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
299-87-314-11-001101

299-87-314-11-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

6,727 2.21

RFQ

299-87-314-11-001101

Datasheet

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-008101

116-83-420-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

7,280 2.21

RFQ

116-83-420-41-008101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-422-41-001101

121-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

6,220 2.22

RFQ

121-83-422-41-001101

Datasheet

Bulk 121 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-328-41-035101

146-87-328-41-035101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

9,261 2.22

RFQ

146-87-328-41-035101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-328-41-036101

146-87-328-41-036101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

7,646 2.22

RFQ

146-87-328-41-036101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-624-41-001101

122-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

5,448 2.22

RFQ

122-87-624-41-001101

Datasheet

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-624-41-001101

123-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

9,303 2.22

RFQ

123-87-624-41-001101

Datasheet

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-011101

116-87-320-41-011101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

5,171 2.22

RFQ

116-87-320-41-011101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-002101

116-83-322-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

7,947 2.37

RFQ

116-83-322-41-002101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-950-41-001101

110-87-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

9,222 2.22

RFQ

110-87-950-41-001101

Datasheet

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-013101

116-83-610-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

7,270 2.44

RFQ

116-83-610-41-013101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-007101

116-87-328-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

8,685 2.44

RFQ

116-87-328-41-007101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-006101

116-83-628-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

6,617 2.45

RFQ

116-83-628-41-006101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-044-12-071101

510-83-044-12-071101

CONN SOCKET PGA 44POS GOLD

Preci-Dip

7,028 2.24

RFQ

510-83-044-12-071101

Datasheet

Bulk 510 Active PGA 44 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-312-11-001101

299-83-312-11-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

5,290 2.24

RFQ

299-83-312-11-001101

Datasheet

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-652-41-001101

110-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

5,366 2.24

RFQ

110-87-652-41-001101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-642-41-105101

110-87-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

5,962 2.47

RFQ

110-87-642-41-105101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
19-0518-10T

19-0518-10T

CONN SOCKET SIP 19POS GOLD

Aries Electronics

8,711 2.40

RFQ

19-0518-10T

Datasheet

Bulk 518 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0508-20

05-0508-20

CONN SOCKET SIP 5POS GOLD

Aries Electronics

5,672 2.40

RFQ

05-0508-20

Datasheet

Bulk 508 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
05-0508-30

05-0508-30

CONN SOCKET SIP 5POS GOLD

Aries Electronics

7,224 2.40

RFQ

05-0508-30

Datasheet

Bulk 508 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
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  • Quality assurance, Original authentic

    Quality assurance, Original authentic

    All Anmsi components are from the original factory or agent Regular channel procurement

    Global Supply Chain

    Global Supply Chain

    Enables us to resolve all shortages of customers.efficient BOM materials offer and professional technical support.

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