Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-9513-11H

20-9513-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,754 10.16

RFQ

20-9513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-810-90TWR

16-810-90TWR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

1,745 10.16

RFQ

16-810-90TWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-0503-20

18-0503-20

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2,465 10.18

RFQ

18-0503-20

Datasheet

Bulk 0503 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
18-0503-30

18-0503-30

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2,089 10.18

RFQ

18-0503-30

Datasheet

Bulk 0503 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
16-3508-201

16-3508-201

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,053 10.18

RFQ

16-3508-201

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-301

16-3508-301

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,996 10.18

RFQ

16-3508-301

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-822-90

14-822-90

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

9,026 9.58

RFQ

14-822-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
510-83-208-17-081101

510-83-208-17-081101

CONN SOCKET PGA 208POS GOLD

Preci-Dip

8,156 9.65

RFQ

510-83-208-17-081101

Datasheet

Bulk 510 Active PGA 208 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
03-0511-11

03-0511-11

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,823 10.18

RFQ

03-0511-11

Datasheet

Bulk 511 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
13-0501-20

13-0501-20

CONN SOCKET SIP 13POS TIN

Aries Electronics

1,128 10.18

RFQ

13-0501-20

Datasheet

Bulk 501 Active SIP 13 (1 x 13) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
13-0501-30

13-0501-30

CONN SOCKET SIP 13POS TIN

Aries Electronics

1,169 10.18

RFQ

13-0501-30

Datasheet

Bulk 501 Active SIP 13 (1 x 13) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-71250-10

10-71250-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

1,463 10.18

RFQ

10-71250-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-7350-10

10-7350-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

2,808 10.18

RFQ

10-7350-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-7400-10

10-7400-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

4,650 10.18

RFQ

10-7400-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-7410-10

10-7410-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

1,826 10.18

RFQ

10-7410-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-7450-10

10-7450-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

2,181 10.18

RFQ

10-7450-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-7475-10

10-7475-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

4,428 10.18

RFQ

10-7475-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-7500-10

10-7500-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

2,596 10.18

RFQ

10-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-7550-10

10-7550-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

2,697 10.18

RFQ

10-7550-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-7560-10

10-7560-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

4,697 10.18

RFQ

10-7560-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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    Quality assurance, Original authentic

    All Anmsi components are from the original factory or agent Regular channel procurement

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    Global Supply Chain

    Enables us to resolve all shortages of customers.efficient BOM materials offer and professional technical support.

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