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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR 08-HZW/TNCONN IC DIP SOCKET 8POS GOLD |
5,034 | 1.47 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
210-43-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
5,299 | 1.49 |
RFQ |
Datasheet |
Tube | 210 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-47-624-41-001000CONN IC DIP SOCKET 24POS GOLD |
6,395 | 1.52 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
210-1-20-003CONN IC DIP SOCKET 20POS GOLD |
6,076 | 1.53 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
8420-11B1-RK-TPCONN SOCKET PLCC 20POS TIN |
6,197 | 1.58 |
RFQ |
Datasheet |
Tube | 8400 | Active | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
PLCC-84-ATPLCC 84P THROUGH HOLE |
7,759 | 1.59 |
RFQ |
Datasheet |
Tube | PLCC | Active | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
A-CCS 052-Z-TIC SOCKET PLCC 52POS TIN |
5,204 | 1.64 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
110-43-308-10-001000CONN IC DIP SOCKET 8POS GOLD |
7,743 | 1.64 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4), 4 Loaded | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-99-628-41-001000CONN IC DIP SOCKET 28POS TINLEAD |
8,105 | 1.66 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
210-43-316-41-001000CONN IC DIP SOCKET 16POS GOLD |
7,295 | 1.70 |
RFQ |
Datasheet |
Tube | 210 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
ICM-640-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 40P |
7,162 | 1.70 |
RFQ |
Datasheet |
Tube | ICM | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
8428-21B1-RK-TPCONN SOCKET PLCC 28POS TIN |
8,924 | 1.71 |
RFQ |
Datasheet |
Tube | 8400 | Active | PLCC | 28 (4 x 7) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
917-47-108-41-005000CONN SOCKET TRANSIST TO-5 8POS |
8,136 | 1.77 |
RFQ |
Datasheet |
Tube | 917 | Active | Transistor, TO-5 | 8 (Round) | - | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-47-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
8,908 | 1.78 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-47-328-41-001000CONN IC DIP SOCKET 28POS GOLD |
5,133 | 1.78 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
A-CCS 084-Z-SMCONN SOCKET PLCC 84POS TIN |
8,942 | 1.82 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled |
|
110-43-314-10-002000CONN IC DIP SOCKET 14POS GOLD |
9,312 | 1.84 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7), 8 Loaded | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
115-93-314-41-003000CONN IC DIP SOCKET 14POS GOLD |
9,732 | 1.84 |
RFQ |
Datasheet |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
08-4513-10CONN IC DIP SOCKET 8POS GOLD |
5,724 | 1.85 |
RFQ |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.4 (10.16mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
|
110-43-316-10-003000CONN IC DIP SOCKET 16POS GOLD |
9,426 | 1.86 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8), 8 Loaded | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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