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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
210-99-640-41-001000

210-99-640-41-001000

CONN IC DIP SOCKET 40POS TINLEAD

Mill-Max Manufacturing Corp.

 1,053 13.54

RFQ

 210-99-640-41-001000

Datasheet

 Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-44-640-41-001000

210-44-640-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

 4,835 13.54

RFQ

 210-44-640-41-001000

Datasheet

 Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-322-41-117000

114-93-322-41-117000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

 4,017 13.54

RFQ

 114-93-322-41-117000

Datasheet

 Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-422-41-117000

114-93-422-41-117000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

 4,581 13.54

RFQ

 114-93-422-41-117000

Datasheet

 Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-322-41-117000

114-43-322-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 1,856 13.54

RFQ

 114-43-322-41-117000

Datasheet

 Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-6820-90C

24-6820-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 2,534 13.58

RFQ

 24-6820-90C

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6822-90C

24-6822-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 2,103 13.58

RFQ

 24-6822-90C

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6823-90C

24-6823-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 1,915 13.58

RFQ

 24-6823-90C

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-41-316-41-105000

110-41-316-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2,267 13.58

RFQ

 110-41-316-41-105000

Datasheet

 Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-424-41-001000

110-11-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 4,591 13.61

RFQ

 110-11-424-41-001000

Datasheet

 Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-322-41-117000

114-41-322-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3,152 13.61

RFQ

 114-41-322-41-117000

Datasheet

 Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-422-41-117000

114-41-422-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 4,989 13.61

RFQ

 114-41-422-41-117000

Datasheet

 Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-322-41-117000

114-91-322-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2,488 13.61

RFQ

 114-91-322-41-117000

Datasheet

 Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-314-31-007000

614-91-314-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 4,476 13.55

RFQ

 614-91-314-31-007000

Datasheet

 Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
15-7350-10

15-7350-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

 1,914 13.55

RFQ

 15-7350-10

Datasheet

 Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7450-10

15-7450-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

 3,144 13.55

RFQ

 15-7450-10

Datasheet

 Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7500-10

15-7500-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

 4,979 13.55

RFQ

 15-7500-10

Datasheet

 Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7540-10

15-7540-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

 2,462 13.55

RFQ

 15-7540-10

Datasheet

 Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7635-10

15-7635-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

 4,372 13.55

RFQ

 15-7635-10

Datasheet

 Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7695-10

15-7695-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

 1,476 13.55

RFQ

 15-7695-10

Datasheet

 Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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