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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TDU03DTONCONN SOCKET TRANSIST 3POS GOLD |
1,382 | 13.80 |
RFQ |
Datasheet |
Tray | - | Active | Transistor | 3 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Board Guide | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
214-3339-00-0602JCONN IC DIP SOCKET ZIF 14POS GLD |
3,369 | 20.95 |
RFQ |
Datasheet |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
224-1275-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD |
3,698 | 22.51 |
RFQ |
Datasheet |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
1-2324271-3RIGHT SEGMEN LGA4189-4 SOCKET-P4 |
3,386 | 29.22 |
RFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-4LEFT SEGMEN LGA4189-4 SOCKET-P4 |
4,833 | 29.22 |
RFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
220-3342-00-0602JCONN IC DIP SOCKET ZIF 20POS GLD |
1,011 | 22.28 |
RFQ |
Datasheet |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
208-7391-55-1902CONN SOCKET SOIC 8POS GOLD |
1,556 | 33.65 |
RFQ |
Datasheet |
Bulk | Textool™ | Active | SOIC | 8 (2 x 4) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
2-2129710-5CONN SOCKET LGA 3647POS GOLD |
3,745 | 35.76 |
RFQ |
Datasheet |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
2-2129710-6CONN SOCKET LGA 3647POS GOLD |
1,059 | 35.88 |
RFQ |
Datasheet |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
248-1282-00-0602JCONN IC DIP SOCKET ZIF 48POS GLD |
1,060 | 36.49 |
RFQ |
Datasheet |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
216-7224-55-1902CONN SOCKET SOIC 16POS GOLD |
1,123 | 37.45 |
RFQ |
Datasheet |
Bulk | Textool™ | Active | SOIC | 16 (2 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
203-2737-55-1102CONN TRANSIST TO-3/TO-66 3POS |
1,436 | 44.28 |
RFQ |
Datasheet |
Bulk | Textool™ | Active | Transistor, TO-3 and TO-66 | 3 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.234 (5.94mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
210-2599-00-0602CONN SOCKET SIP ZIF 10POS GOLD |
2,812 | 45.43 |
RFQ |
Datasheet |
Bulk | Textool™ | Active | SIP, ZIF (ZIP) | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
220-2600-00-0602CONN SOCKET SIP ZIF 20POS GOLD |
4,753 | 47.54 |
RFQ |
Datasheet |
Bulk | Textool™ | Active | SIP, ZIF (ZIP) | 20 (1 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
169-PRS13001-12CONN SOCKET PGA ZIF GOLD |
2,329 | 94.50 |
RFQ |
Datasheet |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
225-PRS15001-12CONN SOCKET PGA ZIF GOLD |
127 | 104.96 |
RFQ |
Datasheet |
Bulk | PRS | Active | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
289-PRS17001-12CONN SOCKET PGA ZIF GOLD |
3,350 | 122.61 |
RFQ |
Datasheet |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
361-PRS19001-12CONN SOCKET PGA ZIF GOLD |
3,657 | 142.65 |
RFQ |
Datasheet |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
441-PRS21001-12CONN SOCKET PGA ZIF GOLD |
3,081 | 164.97 |
RFQ |
Datasheet |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
ICS-306-TIC SOCKET, DIP, 6P 2.54MM PITCH |
11,981 | 0.17 |
RFQ |
Datasheet |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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