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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
30-823-90CCONN IC DIP SOCKET 30POS GOLD |
2,553 | 15.31 |
RFQ |
Datasheet |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
114-41-950-41-117000CONN IC SKT DBL |
4,691 | 15.31 |
RFQ |
Datasheet |
Tube | 114 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
114-91-950-41-117000CONN IC SKT DBL |
2,795 | 15.31 |
RFQ |
Datasheet |
Tube | 114 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-068-11-061001SOCKET SOLDERTAIL 68-PGA |
2,902 | 15.31 |
RFQ |
Tube | 510 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
123-13-318-41-001000CONN IC DIP SOCKET 18POS GOLD |
1,126 | 15.31 |
RFQ |
Datasheet |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-068-10-041001SOCKET SOLDERTAIL 68-PGA |
3,925 | 15.31 |
RFQ |
Datasheet |
Tube | 510 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
410-93-264-41-001000SOCKET DUAL IN-LINE SLDRTL 64POS |
3,247 | 15.32 |
RFQ |
Datasheet |
Tube | 410 | Active | DIP, 0.1 (2.54mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
124-93-314-41-002000CONN IC DIP SOCKET 14POS GOLD |
3,460 | 15.32 |
RFQ |
Datasheet |
Tube | 124 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
124-43-314-41-002000CONN IC SKT DBL |
2,558 | 15.32 |
RFQ |
Datasheet |
Tube | 124 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
123-47-636-41-001000STANDARD WIRE WRAP DBL SKT |
1,414 | 15.32 |
RFQ |
Datasheet |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
546-87-182-14-001135CONN SOCKET PGA 182POS GOLD |
2,394 | 14.53 |
RFQ |
Datasheet |
Bulk | 546 | Active | PGA | 182 (14 x 14) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-87-182-14-001136CONN SOCKET PGA 182POS GOLD |
2,728 | 14.53 |
RFQ |
Datasheet |
Bulk | 546 | Active | PGA | 182 (14 x 14) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
111-41-650-41-001000CONN IC SKT DBL |
1,458 | 15.32 |
RFQ |
Datasheet |
Tube | 111 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
111-91-650-41-001000CONN IC SKT DBL |
2,106 | 15.32 |
RFQ |
Datasheet |
Tube | 111 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
122-11-316-41-001000CONN IC SKT DBL |
1,158 | 15.33 |
RFQ |
Datasheet |
Tube | 122 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
20-81000-610CCONN IC DIP SOCKET 20POS GOLD |
2,472 | 15.33 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-81250-610CCONN IC DIP SOCKET 20POS GOLD |
3,887 | 15.33 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-8400-610CCONN IC DIP SOCKET 20POS GOLD |
3,019 | 15.33 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-8500-610CCONN IC DIP SOCKET 20POS GOLD |
2,434 | 15.33 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-8675-610CCONN IC DIP SOCKET 20POS GOLD |
2,115 | 15.33 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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