Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
714-43-260-31-018000

714-43-260-31-018000

CONN IC DIP SOCKET 60POS GOLD

Mill-Max Manufacturing Corp.

2,114 16.31

RFQ

714-43-260-31-018000

Datasheet

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 60 (2 x 30) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-428-31-012000

614-93-428-31-012000

SOCKET CARRIER LOWPRO .400 28POS

Mill-Max Manufacturing Corp.

3,507 16.31

RFQ

614-93-428-31-012000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-428-31-012000

614-43-428-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,195 16.31

RFQ

614-43-428-31-012000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-328-41-004000

612-43-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,454 16.31

RFQ

612-43-328-41-004000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-428-41-004000

612-43-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,684 16.31

RFQ

612-43-428-41-004000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-628-41-004000

612-43-628-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,058 16.31

RFQ

612-43-628-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-328-41-004000

612-93-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,241 16.31

RFQ

612-93-328-41-004000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-428-41-004000

612-93-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,030 16.31

RFQ

612-93-428-41-004000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-628-41-004000

612-93-628-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,426 16.31

RFQ

612-93-628-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-642-31-002000

614-41-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,043 16.31

RFQ

614-41-642-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-642-31-002000

614-91-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,936 16.31

RFQ

614-91-642-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-318-41-004000

612-43-318-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,551 16.32

RFQ

612-43-318-41-004000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-318-41-004000

612-93-318-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,948 16.32

RFQ

612-93-318-41-004000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
TMJ03DKSD-S1512

TMJ03DKSD-S1512

CONN TRANSIST TO-254 3POS GOLD

Sullins Connector Solutions

2,086 16.32

RFQ

TMJ03DKSD-S1512

Datasheet

Tray - Active Transistor, TO-254 3 (Rectangular) 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Flange Solder 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
605-93-640-11-480000

605-93-640-11-480000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

1,589 16.33

RFQ

605-93-640-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-640-11-480000

605-43-640-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

4,684 16.33

RFQ

605-43-640-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
23-7400-10

23-7400-10

CONN SOCKET SIP 23POS TIN

Aries Electronics

1,657 16.33

RFQ

23-7400-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 23 (1 x 23) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-3503-20

34-3503-20

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

1,233 16.33

RFQ

34-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-3503-30

34-3503-30

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

4,195 16.33

RFQ

34-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
81-PGM09001-10

81-PGM09001-10

CONN SOCKET PGA GOLD

Aries Electronics

4,278 16.33

RFQ

81-PGM09001-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • Quality assurance, Original authentic

    Quality assurance, Original authentic

    All Anmsi components are from the original factory or agent Regular channel procurement

    Global Supply Chain

    Global Supply Chain

    Enables us to resolve all shortages of customers.efficient BOM materials offer and professional technical support.

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