+86 13662647789
sales@qtreeic.com
Upload BOM
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
126-43-316-41-003000CONN IC SKT DBL |
3,317 | 16.44 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
24-6823-90CONN IC DIP SOCKET 24POS GOLD |
1,152 | 16.44 |
RFQ |
Datasheet |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
28-6823-90TCONN IC DIP SOCKET 28POS TIN |
2,809 | 16.44 |
RFQ |
Datasheet |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
14-0511-11CONN SOCKET SIP 14POS GOLD |
1,589 | 16.45 |
RFQ |
Datasheet |
Bulk | 511 | Active | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
111-47-950-41-001000STANDRD SOLDRTL DBL SKT |
2,519 | 16.46 |
RFQ |
Datasheet |
Tube | 111 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
127-93-430-41-003000CONN IC DIP SOCKET 30POS GOLD |
2,829 | 16.46 |
RFQ |
Datasheet |
Tube | 127 | Active | DIP, 0.4 (10.16mm) Row Spacing | 30 (2 x 15) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
127-43-430-41-003000CONN IC SKT DBL |
1,588 | 16.46 |
RFQ |
Datasheet |
Tube | 127 | Active | DIP, 0.4 (10.16mm) Row Spacing | 30 (2 x 15) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-41-432-41-004000SKT CARRIER SOLDRTL |
2,455 | 16.46 |
RFQ |
Datasheet |
Tube | 612 | Active | DIP, 0.4 (10.16mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-41-632-41-004000SKT CARRIER SOLDRTL |
2,512 | 16.46 |
RFQ |
Datasheet |
Tube | 612 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-91-432-41-004000SKT CARRIER SOLDRTL |
4,193 | 16.46 |
RFQ |
Datasheet |
Tube | 612 | Active | DIP, 0.4 (10.16mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-91-632-41-004000SKT CARRIER SOLDRTL |
4,431 | 16.46 |
RFQ |
Datasheet |
Tube | 612 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
20-0503-21CONN SOCKET SIP 20POS GOLD |
4,578 | 16.46 |
RFQ |
Datasheet |
Bulk | 0503 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
20-0503-31CONN SOCKET SIP 20POS GOLD |
4,597 | 16.46 |
RFQ |
Datasheet |
Bulk | 0503 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
111-93-952-41-001000CONN IC DIP SOCKET 52POS GOLD |
4,252 | 16.46 |
RFQ |
Datasheet |
Tube | 111 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
111-43-952-41-001000CONN IC SKT DBL |
2,467 | 16.46 |
RFQ |
Datasheet |
Tube | 111 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-83-361-19-000101CONN SOCKET PGA 361POS GOLD |
2,581 | 15.66 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 361 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
146-93-640-41-012000CONN IC DIP SOCKET 40POS GOLD |
4,505 | 16.46 |
RFQ |
Datasheet |
Tube | 146 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
146-43-640-41-012000CONN SKT DBL |
1,783 | 16.46 |
RFQ |
Datasheet |
Tube | 146 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
18-822-90ECONN IC DIP SOCKET 18POS TIN |
2,400 | 16.48 |
RFQ |
Datasheet |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
126-93-432-41-001000CONN IC DIP SOCKET 32POS GOLD |
1,651 | 16.48 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.4 (10.16mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Request a Quote
-
Quality assurance, Original authentic
All Anmsi components are from the original factory or agent Regular channel procurement
-
Global Supply Chain
Enables us to resolve all shortages of customers.efficient BOM materials offer and professional technical support.
