Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-91-952-31-002000

614-91-952-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,253 18.24

RFQ

614-91-952-31-002000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-642-41-002000

126-41-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,677 18.24

RFQ

126-41-642-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-642-41-002000

126-91-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,626 18.24

RFQ

126-91-642-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
36-3551-10

36-3551-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

4,102 18.24

RFQ

36-3551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3553-10

36-3553-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

1,630 18.24

RFQ

36-3553-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6551-10

36-6551-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,846 18.24

RFQ

36-6551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6552-10

36-6552-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

4,339 18.24

RFQ

36-6552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6553-10

36-6553-10

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

4,158 18.24

RFQ

36-6553-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3552-10

36-3552-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,774 18.24

RFQ

36-3552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3554-10

36-3554-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

4,394 18.24

RFQ

36-3554-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6554-10

36-6554-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

4,651 18.24

RFQ

36-6554-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-1508-20

42-1508-20

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

1,075 18.24

RFQ

42-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
612-11-636-41-001000

612-11-636-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,420 18.25

RFQ

612-11-636-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-652-31-018000

614-93-652-31-018000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3,878 18.26

RFQ

614-93-652-31-018000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-652-31-018000

614-43-652-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,130 18.26

RFQ

614-43-652-31-018000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-310-61-001000

110-44-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,017 18.27

RFQ

Tube * Active - - - - - - - - - - - - - -
110-99-310-61-001000

110-99-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,695 18.27

RFQ

Tube * Active - - - - - - - - - - - - - -
614-93-952-31-012000

614-93-952-31-012000

SOCKET CARRIER LOWPRO .900 52POS

Mill-Max Manufacturing Corp.

1,425 18.30

RFQ

614-93-952-31-012000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-952-31-012000

614-43-952-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,040 18.30

RFQ

614-43-952-31-012000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-6503-21

20-6503-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,924 18.31

RFQ

20-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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  • Quality assurance, Original authentic

    Quality assurance, Original authentic

    All Anmsi components are from the original factory or agent Regular channel procurement

    Global Supply Chain

    Global Supply Chain

    Enables us to resolve all shortages of customers.efficient BOM materials offer and professional technical support.

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