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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
123-13-636-41-001000CONN IC DIP SOCKET 36POS GOLD |
1,768 | 19.97 |
RFQ |
Datasheet |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
22-0511-11CONN SOCKET SIP 22POS GOLD |
2,116 | 19.97 |
RFQ |
Datasheet |
Bulk | 511 | Active | SIP | 22 (1 x 22) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
126-41-650-41-002000CONN IC SKT DBL |
4,277 | 19.98 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-41-950-41-002000CONN IC SKT DBL |
2,039 | 19.98 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-91-650-41-002000CONN IC SKT DBL |
4,362 | 19.98 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-91-950-41-002000CONN IC SKT DBL |
2,693 | 19.98 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-93-964-41-003000CONN IC DIP SOCKET 64POS GOLD |
3,382 | 19.98 |
RFQ |
Datasheet |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-43-964-41-003000CONN IC SKT DBL |
3,830 | 19.98 |
RFQ |
Datasheet |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
115-44-322-61-003000CONN IC SKT DBL |
4,003 | 19.99 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-43-310-61-008000CONN IC SKT DBL |
3,528 | 19.99 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-310-61-008000CONN IC SKT DBL |
4,632 | 19.99 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
48-6556-30UNIVERSAL TEST SOCKET 48POS |
3,576 | 19.99 |
RFQ |
- | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
48-6556-20CONN IC DIP SOCKET 48POS GOLD |
2,985 | 19.99 |
RFQ |
Datasheet |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-3551-10CONN IC DIP SOCKET ZIF 48POS TIN |
3,195 | 19.99 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-3552-10CONN IC DIP SOCKET ZIF 48POS TIN |
2,022 | 19.99 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-3553-10CONN IC DIP SOCKET ZIF 48POS TIN |
3,524 | 19.99 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-6551-10CONN IC DIP SOCKET ZIF 48POS TIN |
2,556 | 19.99 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-6552-10CONN IC DIP SOCKET ZIF 48POS TIN |
1,206 | 19.99 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-3554-10CONN IC DIP SOCKET ZIF 48POS TIN |
1,365 | 19.99 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-6553-10CONN IC DIP SOCKET ZIF 48POS TIN |
2,205 | 19.99 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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