+86 13662647789+86 13662647789 sales@qtreeic.comsales@qtreeic.com
Upload BOMUpload BOM
Cart
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-3572-10

40-3572-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 4,331 20.37

RFQ

 40-3572-10

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3573-10

40-3573-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 2,455 20.37

RFQ

 40-3573-10

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3575-10

40-3575-10

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 2,280 20.37

RFQ

 40-3575-10

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6571-10

40-6571-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 3,036 20.37

RFQ

 40-6571-10

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6573-10

40-6573-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 3,339 20.37

RFQ

 40-6573-10

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6575-10

40-6575-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 2,589 20.37

RFQ

 40-6575-10

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
116-43-310-61-001000

116-43-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 1,930 20.38

RFQ

 Tube * Active - - - - - - - - - - - - - -
116-93-310-61-001000

116-93-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 4,881 20.38

RFQ

 Tube * Active - - - - - - - - - - - - - -
27-0501-21

27-0501-21

CONN SOCKET SIP 27POS GOLD

Aries Electronics

 1,615 20.38

RFQ

 27-0501-21

Datasheet

 Bulk 501 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-0501-31

27-0501-31

CONN SOCKET SIP 27POS GOLD

Aries Electronics

 4,434 20.38

RFQ

 27-0501-31

Datasheet

 Bulk 501 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-0501-20

36-0501-20

CONN SOCKET SIP 36POS TIN

Aries Electronics

 4,324 20.38

RFQ

 36-0501-20

Datasheet

 Bulk 501 Active SIP 36 (1 x 36) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-0501-30

36-0501-30

CONN SOCKET SIP 36POS TIN

Aries Electronics

 3,318 20.38

RFQ

 36-0501-30

Datasheet

 Bulk 501 Active SIP 36 (1 x 36) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
156-PGM16012-10

156-PGM16012-10

CONN SOCKET PGA GOLD

Aries Electronics

 2,621 20.38

RFQ

 156-PGM16012-10

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6556-21

24-6556-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 2,152 20.39

RFQ

 24-6556-21

Datasheet

 Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
24-6556-31

24-6556-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 1,897 20.39

RFQ

 24-6556-31

Datasheet

 Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
22-3503-21

22-3503-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

 2,031 20.40

RFQ

 22-3503-21

Datasheet

 Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-3503-31

22-3503-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

 3,462 20.40

RFQ

 22-3503-31

Datasheet

 Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-526-11

40-526-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 2,217 20.41

RFQ

 40-526-11

Datasheet

 Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
612-43-648-41-004000

612-43-648-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

 3,701 20.41

RFQ

 612-43-648-41-004000

Datasheet

 Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-648-41-004000

612-93-648-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

 2,852 20.41

RFQ

 612-93-648-41-004000

Datasheet

 Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 561562563564565566567568...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
    • Quality assurance, Original authentic

    Quality assurance, Original authentic

    All Anmsi components are from the original factory or agent Regular channel procurement

    Global Supply Chain

    Global Supply Chain

    Enables us to resolve all shortages of customers.efficient BOM materials offer and professional technical support.

    HOME

    HOME

     PRODUCT

    PRODUCT

     PHONE

    PHONE

     USER

    USER