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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
517-83-370-19-121111

517-83-370-19-121111

CONN SOCKET PGA 370POS GOLD

Preci-Dip

 4,831 22.13

RFQ

 517-83-370-19-121111

Datasheet

 Bulk 517 Active PGA 370 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
30-0511-11

30-0511-11

CONN SOCKET SIP 30POS GOLD

Aries Electronics

 4,926 23.43

RFQ

 30-0511-11

Datasheet

 Bulk 511 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
117-43-620-61-105000

117-43-620-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 1,138 23.44

RFQ

 Tube * Active - - - - - - - - - - - - - -
550-10-292M20-001166

550-10-292M20-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

 1,914 22.49

RFQ

 550-10-292M20-001166

Datasheet

 Bulk 550 Active BGA 292 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
123-13-652-41-001000

123-13-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

 1,154 23.46

RFQ

 123-13-652-41-001000

Datasheet

 Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-93-664-41-003000

127-93-664-41-003000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

 3,028 23.46

RFQ

 127-93-664-41-003000

Datasheet

 Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-664-41-003000

127-43-664-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2,679 23.46

RFQ

 127-43-664-41-003000

Datasheet

 Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-322-61-001000

116-43-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3,314 23.46

RFQ

 Tube * Active - - - - - - - - - - - - - -
116-43-422-61-001000

116-43-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3,531 23.46

RFQ

 Tube * Active - - - - - - - - - - - - - -
116-93-322-61-001000

116-93-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2,712 23.46

RFQ

 Tube * Active - - - - - - - - - - - - - -
116-93-422-61-001000

116-93-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 1,969 23.46

RFQ

 Tube * Active - - - - - - - - - - - - - -
614-83-181-15-051112

614-83-181-15-051112

CONN SOCKET PGA 181POS GOLD

Preci-Dip

 4,711 22.17

RFQ

 614-83-181-15-051112

Datasheet

 Bulk 614 Active PGA 181 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-0508-21

32-0508-21

CONN SOCKET SIP 32POS GOLD

Aries Electronics

 4,647 23.51

RFQ

 32-0508-21

Datasheet

 Bulk 508 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
32-0508-31

32-0508-31

CONN SOCKET SIP 32POS GOLD

Aries Electronics

 4,102 23.51

RFQ

 32-0508-31

Datasheet

 Bulk 508 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
510-93-145-15-081001

510-93-145-15-081001

CONN SOCKET PGA 145POS GOLD

Mill-Max Manufacturing Corp.

 1,569 23.52

RFQ

 510-93-145-15-081001

Datasheet

 Tube 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-43-145-15-081001

510-43-145-15-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2,541 23.52

RFQ

 510-43-145-15-081001

Datasheet

 Tube 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-1508-21

32-1508-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 2,997 23.53

RFQ

 32-1508-21

Datasheet

 Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
32-1508-31

32-1508-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 2,363 23.53

RFQ

 32-1508-31

Datasheet

 Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
24-3508-212

24-3508-212

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 1,825 23.53

RFQ

 24-3508-212

Datasheet

 Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-312

24-3508-312

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 1,037 23.53

RFQ

 24-3508-312

Datasheet

 Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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