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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-13-624-61-801000CONN IC SKT DBL |
3,020 | 25.36 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
117-43-652-61-005000CONN IC SKT DBL |
2,580 | 25.36 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
117-93-652-61-005000CONN IC SKT DBL |
2,842 | 25.36 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-43-640-61-007000CONN IC SKT DBL |
1,468 | 25.36 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-640-61-007000CONN IC SKT DBL |
1,817 | 25.36 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
518-77-192M16-001106CONN SOCKET PGA 192POS GOLD |
3,683 | 23.84 |
RFQ |
Datasheet |
Bulk | 518 | Active | PGA | 192 (16 x 16) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
115-43-950-61-001000CONN IC SKT DBL |
3,962 | 25.42 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
115-93-950-61-001000CONN IC SKT DBL |
3,763 | 25.42 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
510-91-092-11-041001SOCKET SOLDERTAIL 92-PGA |
1,927 | 25.43 |
RFQ |
Bulk | 510 | Active | PGA | 92 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-092-11-041002SKT PGA SOLDRTL |
1,347 | 25.43 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 92 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-092-11-041003SKT PGA SOLDRTL |
3,957 | 25.43 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 92 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
122-11-964-41-001000CONN IC SKT DBL |
2,743 | 25.44 |
RFQ |
Datasheet |
Tube | 122 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
32-6574-11CONN IC DIP SOCKET ZIF 32POS TIN |
4,844 | 25.45 |
RFQ |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
32-6572-11CONN IC DIP SOCKET ZIF 32POS TIN |
2,994 | 25.45 |
RFQ |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
50-9518-10ECONN IC DIP SOCKET 50POS GOLD |
3,436 | 25.49 |
RFQ |
Datasheet |
Bulk | 518 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
32-6503-21CONN IC DIP SOCKET 32POS GOLD |
3,198 | 25.52 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
32-6503-31CONN IC DIP SOCKET 32POS GOLD |
4,683 | 25.52 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
110-13-652-61-001000CONN IC SKT DBL |
4,821 | 25.53 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
123-13-640-41-801000CONN IC DIP SOCKET 40POS GOLD |
1,058 | 25.56 |
RFQ |
Datasheet |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
22-4508-21CONN IC DIP SOCKET 22POS GOLD |
1,829 | 25.58 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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