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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-089-13-082002

510-93-089-13-082002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2,669 27.19

RFQ

 510-93-089-13-082002

Datasheet

 Bulk 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-089-13-082003

510-93-089-13-082003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2,400 27.19

RFQ

 510-93-089-13-082003

Datasheet

 Bulk 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-089-13-082001

510-93-089-13-082001

SOCKET SOLDERTAIL 89-PGA

Mill-Max Manufacturing Corp.

 2,994 27.19

RFQ

 Tube 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-9503-21

32-9503-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 2,772 27.19

RFQ

 32-9503-21

Datasheet

 Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-9503-31

32-9503-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 3,876 27.19

RFQ

 32-9503-31

Datasheet

 Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-0511-11

36-0511-11

CONN SOCKET SIP 36POS GOLD

Aries Electronics

 2,067 27.21

RFQ

 36-0511-11

Datasheet

 Bulk 511 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-13-632-61-801000

110-13-632-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 1,707 27.22

RFQ

 Tube * Active - - - - - - - - - - - - - -
117-43-448-61-105000

117-43-448-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 1,334 27.22

RFQ

 Tube * Active - - - - - - - - - - - - - -
117-43-648-61-105000

117-43-648-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 4,551 27.22

RFQ

 Tube * Active - - - - - - - - - - - - - -
34-3503-21

34-3503-21

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

 1,752 27.26

RFQ

 34-3503-21

Datasheet

 Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-3503-31

34-3503-31

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

 2,108 27.26

RFQ

 34-3503-31

Datasheet

 Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-43-648-61-008000

116-43-648-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 4,286 27.35

RFQ

 Tube * Active - - - - - - - - - - - - - -
116-93-648-61-008000

116-93-648-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2,107 27.35

RFQ

 Tube * Active - - - - - - - - - - - - - -
APA-632-G-Q

APA-632-G-Q

ADAPTER PLUG

Samtec Inc.

 4,678 27.35

RFQ

 Tube APA Active - 32 (2 x 16) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-43-642-61-001000

116-43-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 4,070 27.39

RFQ

 Tube * Active - - - - - - - - - - - - - -
116-93-642-61-001000

116-93-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 1,316 27.39

RFQ

 Tube * Active - - - - - - - - - - - - - -
64-9503-20

64-9503-20

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

 1,371 27.39

RFQ

 64-9503-20

Datasheet

 Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
64-9503-30

64-9503-30

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

 1,907 27.39

RFQ

 64-9503-30

Datasheet

 Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
100-PGM13061-11

100-PGM13061-11

CONN SOCKET PGA GOLD

Aries Electronics

 4,420 27.43

RFQ

 100-PGM13061-11

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
100-PGM13069-11

100-PGM13069-11

CONN SOCKET PGA GOLD

Aries Electronics

 3,383 27.43

RFQ

 100-PGM13069-11

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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