Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
42-6552-11

42-6552-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

3,610 30.16

RFQ

42-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3554-11

42-3554-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

1,508 30.16

RFQ

42-3554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6554-11

42-6554-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

3,713 30.16

RFQ

42-6554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
110-13-640-61-801000

110-13-640-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,040 30.18

RFQ

Tube * Active - - - - - - - - - - - - - -
510-91-156-15-061002

510-91-156-15-061002

SOCKET SOLDERTAIL 156-PGA

Mill-Max Manufacturing Corp.

1,064 30.21

RFQ

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-156-15-061001

510-91-156-15-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,197 30.21

RFQ

510-91-156-15-061001

Datasheet

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-156-15-061003

510-91-156-15-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,795 30.21

RFQ

510-91-156-15-061003

Datasheet

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-764-61-105000

117-43-764-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,382 30.23

RFQ

Tube * Active - - - - - - - - - - - - - -
117-43-664-61-105000

117-43-664-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,529 30.23

RFQ

Tube * Active - - - - - - - - - - - - - -
24-3570-16

24-3570-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

3,497 30.26

RFQ

24-3570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
24-3571-16

24-3571-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

1,897 30.26

RFQ

24-3571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
24-3572-16

24-3572-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

1,998 30.26

RFQ

24-3572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
510-93-120-13-061001

510-93-120-13-061001

SOCKET SOLDERTAIL 120-PGA

Mill-Max Manufacturing Corp.

3,298 30.32

RFQ

Tube 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-120-13-061002

510-93-120-13-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,495 30.32

RFQ

510-93-120-13-061002

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-120-13-061003

510-93-120-13-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,582 30.32

RFQ

510-93-120-13-061003

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6508-212

32-6508-212

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,426 30.33

RFQ

32-6508-212

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-312

32-6508-312

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

4,386 30.33

RFQ

32-6508-312

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-43-120-13-061001

510-43-120-13-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,649 30.33

RFQ

510-43-120-13-061001

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
38-3503-21

38-3503-21

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

1,091 30.38

RFQ

38-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
38-3503-31

38-3503-31

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2,508 30.38

RFQ

38-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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  • Quality assurance, Original authentic

    Quality assurance, Original authentic

    All Anmsi components are from the original factory or agent Regular channel procurement

    Global Supply Chain

    Global Supply Chain

    Enables us to resolve all shortages of customers.efficient BOM materials offer and professional technical support.

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