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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-87-308-41-006101CONN IC DIP SOCKET 8POS GOLD |
12,500 | 0.43 |
RFQ |
Datasheet |
Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-308-41-105161CONN IC DIP SOCKET 8POS GOLD |
11,890 | 0.57 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
612-87-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
11,949 | 0.41 |
RFQ |
Datasheet |
Bulk | 612 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-304-41-009101CONN IC DIP SOCKET 4POS GOLD |
14,077 | 0.42 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
AW 127-29/Z-TSOCKET 29 CONTACTS SINGLE ROW |
14,538 | 0.45 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
612-83-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
10,462 | 0.42 |
RFQ |
Datasheet |
Bulk | 612 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
AW 127-10/Z-TSOCKET 10 CONTACTS SINGLE ROW |
13,694 | 0.46 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
122-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
12,084 | 0.47 |
RFQ |
Datasheet |
Bulk | 122 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
123-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
14,339 | 0.47 |
RFQ |
Datasheet |
Bulk | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
ED020PLCZ-SM-NCONN SOCKET PLCC 20POS |
10,442 | 0.46 |
RFQ |
Datasheet |
Tube | ED | Active | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | - | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | - | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
110-83-308-41-005101CONN IC DIP SOCKET 8POS GOLD |
14,195 | 0.43 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-83-308-41-605101CONN IC DIP SOCKET 8POS GOLD |
14,650 | 0.43 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-306-41-006101CONN IC DIP SOCKET 6POS GOLD |
10,664 | 0.43 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
AW 127-30/Z-TSOCKET 30 CONTACTS SINGLE ROW |
14,373 | 0.47 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
D01-9970842CONN SOCKET SIP 8POS GOLD |
14,871 | 0.47 |
RFQ |
Datasheet |
Tube | D01-997 | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
115-87-312-41-001101CONN IC DIP SOCKET 12POS GOLD |
11,237 | 0.45 |
RFQ |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
BU-08OZCONN IC DIP SOCKET 8POS |
11,574 | 0.48 |
RFQ |
Tube | BU | Active | - | 8 (2 x 4) | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
AW 127-31/Z-TSOCKET 31 CONTACTS SINGLE ROW |
14,159 | 0.48 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
110-87-314-41-005101CONN IC DIP SOCKET 14POS GOLD |
11,074 | 0.45 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-314-41-605101CONN IC DIP SOCKET 14POS GOLD |
12,893 | 0.45 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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