Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
514-83-356M26-001148CONN SOCKET BGA 356POS GOLD |
3,612 | 39.04 |
RFQ |
![]() Datasheet |
Bulk | 514 | Active | BGA | 356 (26 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
![]() |
550-10-296-19-131135PGA SOLDER TAIL |
1,384 | 39.14 |
RFQ |
![]() Datasheet |
Bulk | 550 | Active | PGA | 296 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
![]() |
510-13-142-15-085003SKT PGA SOLDRTL |
3,084 | 41.04 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 142 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
175-PGM16003-11HCONN SOCKET PGA GOLD |
2,268 | 41.11 |
RFQ |
![]() Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
![]() |
175-PGM16008-11CONN SOCKET PGA GOLD |
1,089 | 41.11 |
RFQ |
![]() Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
![]() |
514-83-360M19-001148CONN SOCKET BGA 360POS GOLD |
1,640 | 38.59 |
RFQ |
![]() Datasheet |
Bulk | 514 | Active | BGA | 360 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
![]() |
550-10-357M19-001152BGA SOLDER TAIL |
3,934 | 38.59 |
RFQ |
![]() Datasheet |
Bulk | 550 | Active | BGA | 357 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
![]() |
50-9503-21CONN IC DIP SOCKET 50POS GOLD |
1,753 | 41.18 |
RFQ |
![]() Datasheet |
Bulk | 503 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
![]() |
50-9503-31CONN IC DIP SOCKET 50POS GOLD |
3,962 | 41.18 |
RFQ |
![]() Datasheet |
Bulk | 503 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
![]() |
32-6574-16CONN IC DIP SOCKET ZIF 32POS TIN |
1,550 | 41.21 |
RFQ |
![]() Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
![]() |
510-13-144-12-000001SKT PGA SOLDRTL |
2,868 | 41.37 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 144 (12 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
510-13-144-12-000002SKT PGA SOLDRTL |
4,687 | 41.37 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 144 (12 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
510-13-144-12-000003SKT PGA SOLDRTL |
1,832 | 41.37 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 144 (12 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
510-13-144-13-041001SKT PGA SOLDRTL |
2,099 | 41.37 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 144 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
510-13-144-13-041002SKT PGA SOLDRTL |
3,999 | 41.37 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 144 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
510-13-144-13-041003SKT PGA SOLDRTL |
4,700 | 41.37 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 144 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
510-13-144-15-082002SKT PGA SOLDRTL |
2,501 | 41.37 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 144 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
510-13-144-15-082003SKT PGA SOLDRTL |
1,408 | 41.37 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 144 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
510-13-144-15-082001SKT PGA SOLDRTL |
2,536 | 41.37 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 144 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
550-10-360M19-001152BGA SOLDER TAIL |
3,455 | 38.91 |
RFQ |
![]() Datasheet |
Bulk | 550 | Active | BGA | 360 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
All Anmsi components are from the original factory or agent Regular channel procurement
Enables us to resolve all shortages of customers.efficient BOM materials offer and professional technical support.