Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
AR 32-HZL-TT

AR 32-HZL-TT

CONN IC DIP SOCKET 32POS TIN

Assmann WSW Components

13,816 0.65

RFQ

AR 32-HZL-TT

Datasheet

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
110-83-316-01-822101

110-83-316-01-822101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

10,227 0.62

RFQ

110-83-316-01-822101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8), 4 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-008101

116-83-306-41-008101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

14,684 0.69

RFQ

116-83-306-41-008101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-312-41-001101

612-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

12,743 0.62

RFQ

612-87-312-41-001101

Datasheet

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-011101

116-87-306-41-011101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

14,661 0.62

RFQ

116-87-306-41-011101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-308-31-012101

614-83-308-31-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

10,077 0.62

RFQ

614-83-308-31-012101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-40/Z-T

AW 127-40/Z-T

SOCKET 40 CONTACTS SINGLE ROW

Assmann WSW Components

11,404 0.66

RFQ

AW 127-40/Z-T

Datasheet

- - Active - - - - - - - - - - - - - -
116-87-308-41-002101

116-87-308-41-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

11,790 0.62

RFQ

116-87-308-41-002101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-018101

116-83-308-41-018101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

14,738 0.63

RFQ

116-83-308-41-018101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
04-0513-10T

04-0513-10T

CONN SOCKET SIP 4POS GOLD

Aries Electronics

13,319 0.67

RFQ

04-0513-10T

Datasheet

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0503-20

01-0503-20

CONN SOCKET SIP 1POS GOLD

Aries Electronics

12,382 0.67

RFQ

01-0503-20

Datasheet

Bulk 0503 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
01-0503-30

01-0503-30

CONN SOCKET SIP 1POS GOLD

Aries Electronics

11,955 0.67

RFQ

01-0503-30

Datasheet

Bulk 0503 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Tin 30.0µin (0.76µm) Brass Polyamide (PA), Nylon, Glass Filled
116-87-610-41-003101

116-87-610-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

12,627 0.63

RFQ

116-87-610-41-003101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-308-41-035101

146-87-308-41-035101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

12,272 0.63

RFQ

146-87-308-41-035101

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-308-41-036101

146-87-308-41-036101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

13,477 0.63

RFQ

146-87-308-41-036101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-87-216-10-001101

410-87-216-10-001101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

10,572 0.65

RFQ

410-87-216-10-001101

Datasheet

Bulk 410 Active Zig-Zag, Left Stackable 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-87-216-10-002101

410-87-216-10-002101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

12,429 0.65

RFQ

410-87-216-10-002101

Datasheet

Bulk 410 Active Zig-Zag, Right Stackable 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-104-41-005101

917-83-104-41-005101

CONN TRANSIST TO-5 4POS GOLD

Preci-Dip

10,430 0.66

RFQ

917-83-104-41-005101

Datasheet

Bulk 917 Active Transistor, TO-5 4 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-104-41-053101

917-83-104-41-053101

CONN TRANSIST TO-5 4POS GOLD

Preci-Dip

14,863 0.66

RFQ

917-83-104-41-053101

Datasheet

Bulk 917 Active Transistor, TO-5 4 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
02-0513-11H

02-0513-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

13,024 0.69

RFQ

02-0513-11H

Datasheet

Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • Quality assurance, Original authentic

    Quality assurance, Original authentic

    All Anmsi components are from the original factory or agent Regular channel procurement

    Global Supply Chain

    Global Supply Chain

    Enables us to resolve all shortages of customers.efficient BOM materials offer and professional technical support.

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