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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1-2324271-3RIGHT SEGMEN LGA4189-4 SOCKET-P4 |
3,386 | 29.22 |
FFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-4LEFT SEGMEN LGA4189-4 SOCKET-P4 |
4,833 | 29.22 |
FFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
2-2129710-5CONN SOCKET LGA 3647POS GOLD |
3,745 | 35.76 |
FFQ |
Datasheet |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
2-2129710-6CONN SOCKET LGA 3647POS GOLD |
1,059 | 35.88 |
FFQ |
Datasheet |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
1-2199298-1CONN IC DIP SOCKET 6POS TIN |
10,163 | 0.26 |
FFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
1-2199298-2CONN IC DIP SOCKET 8POS TIN |
14,280 | 0.28 |
FFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
1-2199298-3CONN IC DIP SOCKET 14POS TIN |
10,405 | 0.28 |
FFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
1-2199298-4CONN IC DIP SOCKET 16POS TIN |
14,461 | 0.32 |
FFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
1-2199298-5CONN IC DIP SOCKET 18POS TIN |
14,129 | 0.39 |
FFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
1-2199298-6CONN IC DIP SOCKET 20POS TIN |
11,830 | 0.59 |
FFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
1-2199298-8CONN IC DIP SOCKET 24POS TIN |
10,824 | 0.78 |
FFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
1-2199298-9CONN IC DIP SOCKET 28POS TIN |
13,006 | 0.88 |
FFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
|
1-2199299-228P,DIP SKT,600 CL,LDR,PB FREE |
12,551 | 0.88 |
FFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Nickel | Polybutylene Terephthalate (PBT), Glass Filled |
|
1-2199300-2CONN IC DIP SOCKET 32POS TINLEAD |
13,687 | 0.99 |
FFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin-Lead | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame, No Center Bar | Solder | 0.100 (2.54mm) | Tin-Lead | 60.0µin (1.52µm) | Brass, Copper | Polyester |
|
1-2199299-540P,DIP SKT,600 CL,LDR,PB FREE |
7,325 | 1.18 |
FFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Nickel | Polybutylene Terephthalate (PBT), Glass Filled |
|
808-AG11D-ESCONN IC DIP SOCKET 8POS GOLD |
8,471 | 1.19 |
FFQ |
Datasheet |
Tube | 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
1-1814655-1CONN SOCKET SIP 16POS GOLD |
6,658 | 2.12 |
FFQ |
Datasheet |
Bulk | - | Active | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Thermoplastic, Polyester |
|
2-2822979-3CONN SOCKET LGA 3647POS GOLD |
4,430 | 65.72 |
FFQ |
Datasheet |
Tray | - | Active | LGA | 3647 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
8080-1G1CONN TRANSIST TO-3 4POS GOLD |
3,989 | 15.32 |
FFQ |
Datasheet |
Bulk | 8080 | Active | Transistor, TO-3 | 4 (Round) | - | Tin-Lead | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Fluoropolymer (FP) |
|
8080-1G15CONN TRANSIST TO-3 3POS TIN-LEAD |
3,390 | 16.28 |
FFQ |
Datasheet |
Bulk | 8080 | Active | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Fluoropolymer (FP) |
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