Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
44-6551-11

44-6551-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

3,856 31.13

RFQ

44-6551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6552-11

44-6552-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

3,280 31.13

RFQ

44-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3554-11

44-3554-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

3,832 31.13

RFQ

44-3554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6553-11

44-6553-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

4,322 31.13

RFQ

44-6553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6554-11

44-6554-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

1,114 31.13

RFQ

44-6554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-93-128-13-041003

510-93-128-13-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,606 31.13

RFQ

510-93-128-13-041003

Datasheet

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-128-13-041002

510-93-128-13-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,687 31.13

RFQ

510-93-128-13-041002

Datasheet

Tube 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-168-17-101001

510-91-168-17-101001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,618 31.14

RFQ

510-91-168-17-101001

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-168-17-101003

510-91-168-17-101003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,031 31.14

RFQ

510-91-168-17-101003

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-168-17-105001

510-91-168-17-105001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,301 31.14

RFQ

510-91-168-17-105001

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-168-17-105002

510-91-168-17-105002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,414 31.14

RFQ

510-91-168-17-105002

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-168-17-105003

510-91-168-17-105003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,164 31.14

RFQ

510-91-168-17-105003

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-83-281-19-081117

514-83-281-19-081117

CONN SOCKET PGA 281POS GOLD

Preci-Dip

2,581 29.11

RFQ

514-83-281-19-081117

Datasheet

Bulk 514 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
324-13-164-41-002000

324-13-164-41-002000

SOCKET 4 LEVEL WRAPOST SIP 64POS

Mill-Max Manufacturing Corp.

4,413 31.16

RFQ

324-13-164-41-002000

Datasheet

Tube 324 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
84-PGM11010-41

84-PGM11010-41

CONN SOCKET PGA GOLD

Aries Electronics

1,322 31.17

RFQ

84-PGM11010-41

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-13-076-11-041001

510-13-076-11-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,370 31.17

RFQ

510-13-076-11-041001

Datasheet

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-076-11-041002

510-13-076-11-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,884 31.17

RFQ

510-13-076-11-041002

Datasheet

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-076-11-041003

510-13-076-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,313 31.17

RFQ

510-13-076-11-041003

Datasheet

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-256M20-001101

558-10-256M20-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3,911 29.94

RFQ

558-10-256M20-001101

Datasheet

Bulk 558 Active PGA 256 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-256M16-000101

558-10-256M16-000101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3,619 29.27

RFQ

558-10-256M16-000101

Datasheet

Bulk 558 Active PGA 256 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
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  • Quality assurance, Original authentic

    Quality assurance, Original authentic

    All Anmsi components are from the original factory or agent Regular channel procurement

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    Global Supply Chain

    Enables us to resolve all shortages of customers.efficient BOM materials offer and professional technical support.

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